MU · Nasdaq
Micron TechnologyMicron Technology
One theme link, admitted after review.一条主题关联，经审核已纳入。
Read as of 31 Oct 2026数据截至2026年10月31日Update history not tracked yet尚未跟踪更新记录
Where it sits归属位置
Admitted已纳入- Micro-theme细分主题HBM & advanced packagingHBM 与先进封装Admitted place for Micron TechnologyMicron Technology 的已纳入位置
- Sub-theme子主题None — sits directly under its theme无 —— 直接隶属于主题
- Theme主题AI SemiconductorsAI半导体Also listed under Memory, HBM & Storage亦列于：存储与HBM
- Category类别Semiconductors & hardware半导体与硬件Its theme also sits in Technology & software所属主题亦归入：科技与软件
Admitted after review. Used on the map and counted in coverage.经审核已纳入。用于主题地图并计入覆盖率。
Why it was proposed提议依据
- Product产品
- 24GB 8H HBM3E
- Platform平台
- NVIDIA H200
- Customer named所提及客户
- NVIDIANVIDIA
- Stage阶段
- Planned计划中
- On file since收录日期
- 11 Oct 20262026年10月11日
Receipt凭证proposal record, dates, permissions提案记录、日期、权限
- proposal_id
- actprop:287edbf7e04b8aba873b7493
- proposal_status
- RATIFIED
- graph_membership_use
- NOT_GRANTED
- role
- component_supplier
- lifecycle
- planned
- relation
- planned_product_integration
- clocks
- publication 2024-02-26 · knowledge 2026-10-11 · observation 2026-10-09 · effective UNDISCLOSED · admitted NOT_APPLICABLE · correction NOT_APPLICABLE · served_generation NOT_APPLICABLE
- magnitudes
- amount UNDISCLOSED · economic_share UNDISCLOSED · rights: RIGHTS_FAMILY_UNRESOLVED
- source_key
- manual:micron-ir:hbm3e-h200:2024-02-26
- text_sha256
- f79bce81f656e826b3aa74380eb9a2b63bf74fc0e60376dc2b40c64600eb890a
Display rights for this figure are still being confirmed. The source filing is linked.该数值的展示权限仍在确认中。已附来源披露文件链接。
Open the filing打开披露文件Nothing here is inferred beyond the cited text.以上内容均来自引文，未作推断。
What Micron Technology doesMicron Technology 的业务
Principal activity主营业务
Not set yet尚未设定
No reviewed description of Micron Technology’s main business is on file. It will appear here, with its source, once reviewed.目前没有经审核的 Micron Technology 主营业务描述。审核后将连同来源显示于此。
Value-chain position价值链位置
Upstream上游
Midstream中游
Downstream下游
Enabler赋能
Not set yet尚未设定
Not recorded for HBM & advanced packaging yet.HBM 与先进封装的价值链位置尚未记录。